Tokyo, April 13, 2026 – As the global semiconductor industry marches toward advanced process nodes and intelligent manufacturing, polished circular wafers, the core foundational material for semiconductor production, are experiencing rapid technological upgrading and market expansion. Industry data from Mordor Intelligence shows that the global prime polished wafer market volume is expected to reach 9.26 billion square inches in 2026, with a compound annual growth rate (CAGR) of 4.88% from 2026 to 2031, driven by soaring demand from logic chips, memory devices, and power semiconductors. The industry is witnessing a shift toward larger sizes, higher purity, and lower defect density, while green and intelligent manufacturing technologies are reshaping the industrial landscape.
Overseas leading enterprises have made significant breakthroughs in planarization technology, a key process for polished circular wafers. Canon Inc. recently announced the world’s first inkjet-based adaptive planarization (IAP) technology, which leverages the company’s expertise in nanoimprint lithography to achieve ultra-precise wafer smoothing. Unlike traditional chemical mechanical polishing (CMP) methods that involve multiple complex steps, the IAP technology uses an inkjet system to dispense light-curable material precisely according to the wafer’s surface topography, then presses a flat glass plate to level the surface. This innovative process can reduce topographical irregularity to 5 nm or less on 300mm diameter wafers in a single stamping process, laying a solid foundation for advanced semiconductor manufacturing. Canon plans to commercialize equipment integrated with IAP technology in 2027, targeting logic and memory device production.
In terms of product portfolio expansion, Finland-based Okmetic has recently expanded its offerings to include 300mm polished wafers and 150–300mm epitaxial wafers through a qualified partner network, while continuing in-house production of advanced 150–200mm silicon and bonded SOI wafers. This hybrid manufacturing model enhances supply flexibility, allowing Okmetic to cater to diverse applications such as memory, logic, power, and RF devices, while maintaining strong support for its core markets including MEMS and sensors. The company’s expanded 200mm polished wafer capacity entered volume production in early 2026, aligning with industry trends toward supply chain resilience and multi-sourcing.
Domestic enterprises in China are accelerating the localization of high-end polished circular wafers, driven by the country’s semiconductor self-reliance strategy. Major players such as Shanghai Silicon Industry Group, Zhonghuan Semiconductor, and Leon Micro have ramped up production capacity for 12-inch (300mm) polished wafers. As of the end of 2025, China’s monthly production capacity of 12-inch polished wafers reached 120 million pieces, and it is expected to exceed 150 million pieces in 2026. These wafers, which are made from FZ, CZ, or MCZ silicon ingots through cutting, grinding, and polishing processes, meet the highest standards in flatness and surface quality, and are classified into lightly doped and heavily doped types based on dopant concentration. The domestic self-sufficiency rate of 12-inch polished wafers has increased from less than 5% in 2021 to 22.3% in 2024, though gaps remain in high-end products’ purity and defect density compared to international leaders.
Innovations in polishing materials are also fueling industry development. Chempower Corp., a U.S.-based semiconductor materials company, recently launched Chakra, an abrasive-free polishing technology that replaces traditional abrasive slurries with functional polishing pads and cleaner chemical processes. This technology reduces surface damage, produces a more uniform finish, and cuts wastewater, addressing the defect density challenges in advanced semiconductor manufacturing. By avoiding hazardous materials like benzotriazole (BTA) and enabling easier recovery of wastewater and dissolved copper salts, Chakra also enhances the industry’s sustainability, aligning with global low-carbon development goals.
Market demand structure is evolving with the expansion of downstream applications. The 300mm polished wafer segment, which accounted for 73.39% of the global market share in 2025, is projected to grow at a 5.55% CAGR through 2031, driven by foundries’ shift to sub-3nm process technology and the ramp-up of through-silicon-via (TSV) packaging. In China, the market size of semiconductor polished wafers is expected to exceed 20 billion yuan in 2026, with 12-inch products accounting for about 55% of total demand. The Asia-Pacific region remains the largest and fastest-growing market, driven by its robust contract manufacturing base.
Industry experts noted that the polished circular wafer industry is in a critical period of technological iteration and supply chain optimization. While significant progress has been made in large-size wafer production and polishing technology, challenges remain, including reliance on imported high-end polishing equipment and gaps in core materials. Looking ahead, the integration of emerging technologies such as AI and IoT will further improve polishing precision and production efficiency. With continuous R&D investment and strengthened industrial collaboration, the global polished circular wafer industry will continue to support the advancement of the semiconductor sector, enabling innovations in consumer electronics, automotive electrification, and industrial IoT.