Fuzhou, March 4, 2026 – As the semiconductor industry enters the post-Moore era, advanced packaging has become a key path to sustaining chip performance improvements, and glass wafers, as a foundational material for next-generation high-density packaging, are gaining unprecedented attention and driving a new wave of industry growth. Fuzhou AnGuang Optoelectronics Co., Ltd., a high-tech enterprise specializing in precision optical components, is well-positioned to seize this opportunity with its core technological advantages in glass wafer processing.
According to industry reports released by authoritative institutions such as Yole Group, the global semiconductor glass wafer shipment volume is expected to grow at a compound annual growth rate (CAGR) of over 10% from 2025 to 2030, with demand in the storage (HBM) and logic chip packaging segments growing even faster at a CAGR of 33%. This explosive growth is driven by the surging demand for high-density interconnection technologies in high-performance computing (HPC) and artificial intelligence (AI) fields, marking a fundamental shift from traditional organic substrates to glass-based solutions.
Compared with traditional organic substrates such as FR-4, glass wafers exhibit significant advantages that are irreplaceable in advanced packaging scenarios. They feature a thermal expansion coefficient (CTE) highly matching that of silicon (3–5 ppm/°C vs. 2.6 ppm/°C), greatly reducing thermal stress in multi-chip stacking and improving long-term reliability. Additionally, their excellent electrical performance, ultra-smooth surface, and strong design flexibility enable finer line widths (below 2 microns), higher I/O density, and 3D vertical interconnection through Through-Glass Via (TGV) technology, making them ideal for high-frequency, high-speed signal transmission in AI accelerators and server chips.
Global semiconductor giants have already accelerated their layout in glass wafer technology. Intel has invested over $1 billion in building R&D and production facilities for glass wafers, planning to start mass production by 2030, while Samsung Electro-Mechanics has shifted its glass substrate project to the business execution phase, aiming for mass production between 2026 and 2027. Domestically, memory chip manufacturers actively deploying HBM technology, such as JCET and Tianshui Huatian, are also becoming important potential customers for glass wafers, further boosting market demand.
As a professional core supplier of optical components, AnGuang Optoelectronics has established outstanding competitive advantages in the precision processing of glass wafers. The company has built advanced technical platforms including glass wafer manufacturing, mastering core technologies such as precision optical processing and optical thin film technology. With rich experience in the precision processing of medium and large-sized ultra-thin glass wafers, AnGuang can provide customized, high-cost-performance glass wafer products and stable mass production support, meeting the strict quality requirements of downstream customers.
“AnGuang is not only a supplier but also a development partner for customers in optical solutions for new products,” said a senior representative of AnGuang Optoelectronics. “The stringent quality requirements brought by in-depth cooperation have driven us to continuously improve our management system and R&D capabilities, forming a strong technological barrier.” The company has passed GB/T19001-2016/ISO9001:2015 International Quality Management System Certification and GB/T30146-2023/ISO22301:2019 Business Continuity Management System Certification, and has obtained 16 invention and utility model patents, laying a solid foundation for its development in the glass wafer field.
Industry analysts predict that 2026 will be a key node for glass wafers to enter small-batch commercial shipment, and by 2030, glass substrates will gradually replace organic substrates in the high-end HPC market, becoming the standard configuration for trillion-transistor integration. With its technological accumulation and market layout, AnGuang Optoelectronics is poised to leverage the booming market opportunities, deepen its exploration in the glass wafer field, and contribute to the advancement of China’s semiconductor advanced packaging industry.